New leaked 3G firmware ahead of the expected iPhone launch at WWDC on Monday has revealed some detailed information about the chips used next-generation device. The last minute report, courtesy of Engagdet and based on leaked "3G" iPhone firmware, says that Apple will use the Infineon PMB6952 ("S-GOLD3") chip, allowing the phone to be used on both UMTS and HSPA "3G" networks around the world. UTMS-based third-generation "3G" mobile networks are used around the world, while faster HSPA are being rolled out in Europe and the US (AT&T is expected to full HSPA coverage by late June).
The leaked firmware indicates that there will be support for Global Locate Library (GLL) software that handles assisted GPS related commands for the host processor. This would allow the iPhone to more accurately and quickly finding positioning information and points to use of Broadcom's recently acquired worldwide reference network that provides assistance data to its assisted GPS chips via GPRS or 3G mobile networks.
According to the report, Apple is also including three Skyworks chips that would facilitate HSPA/UTMS network connectivity on each of the roaming GSM frequencies around the world, including the 850MHz used by AT&T in the US and 1900MHz and 2100MHz used in Europe, Asia, and other parts of the world.
The leak also shows that the chip will include a Murata LMRX3JCA-479 tri-band amplifier chip, which could be used to boost 3G signals. According to the leak, the phone will also have a Sony SP9T antenna switch for GSM / UMTS dual mode and UMTS Power Saving option (on or off) to conserve battery power.
Like the original iPhone, the report says the new 3G iPhone will sport an ARM 1176JZF-S processor. It also indicates that the internal build number of the iPhone is n82ap, consistent with the "m68ap" designation for the first-generation iPhone.
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